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UTStarcom ships Mindspeed chip in MSTP platform

DECEMBER 20, 2006 -- UTStarcom (search for UTStarcom) has chosen Mindspeed Technologies' (search for Mindspeed Technologies) integrated "line-card-on-a-chip" to be deployed in its next-generation multi-service optical transport platform (MSTP).

The UTStarcom NetRing 10000 platform integrates SONET/SDH add-drop multiplexer (ADM), digital cross-connect, and Ethernet functionality in a single, scalable system. According to company representatives, the next-generation NetRing MSTP products are designed to deliver high-density, highly-efficient STM-1 to STM-64, E1/E3, Fast Ethernet, and Gigabit Ethernet services in SDH-based carrier networks.

"Mindspeed's integrated solution allows UTStarcom to develop next-generation switching solutions for wireline and wireless networking infrastructure applications," explains Steven Chen, deputy general manager of ONS at UTStarcom. "Mindspeed's integrated line-card-on-a-chip solution provides the highest density and lowest-power consumption required for our MSTP platforms."

"We are pleased that UTStarcom chose Mindspeed to supply its semiconductor solution for its next-generation optical transport platform," adds Rammy Bahalul, senior product line manager for Mindspeed. "Our highly integrated 12-port device provides the performance and features demanded by leading network equipment manufacturers such as UTStarcom."

The M29320 family enables networking equipment customers to develop higher density multiservice switches, optical edge devices (OEDs), and other systems with greater scalability and faster time-to-market, say Mindspeed representatives. The 3-, 6-, and 12-port "line-card-on-a-chip" provides a complete physical-layer offering for flexible, high-bandwidth DS3/E3 services, says the company, and it incorporates optimized functions to address DS3/E3 needs for efficient aggregation and channelization for transport applications.


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