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DECEMBER 12, 2007 -- 3S Photonics (search for 3S Photonics) has kicked off a line of 980-nm terrestrial pump laser modules.
The product line consists of three complementary pump laser modules adapted to specific demands of the market: the 1999 PLU (for low powers), 1999 PLM (for medium and high powers), and 1999 CHP (for ultra-high powers). These modules are intended to supply power to amplify the optical signal in optical fiber and thus keep a constant signal quality throughout the network, from transmitters to receivers.
These modules are sold to telecommunication equipment suppliers and mainly integrated in EDFAs. The 3S Photonics 980-nm terrestrial pump laser modules are mainly targeted toward Asian EDFA manufacturers for integration into subsystems sold to global optical network vendors.
Features of the three new products include:
- 1999 PLU: In a mini-DIL package, this coolerless pump module delivers an output power of up to 275 mW.
- 1999 PLM: In a low-profile, cooled butterfly package, this pump module delivers output power of up to 365 mW.
- 1999 CHP: In a low-profile, cooled butterfly package, this pump module delivers output power up to 660 mW.
Low-power modules are typically used in metro networks -- urban networks from 200 to 300 km -- whereas the ultra-high power module is mainly dedicated to long-haul, inter-urban connections.
3S Photonics says its small components incorporate a sophisticated optoelectronic chip that involves a high level of expertise and technology. As narrow as a sugar cube, it is "a key and strategic element in current and future optical telecommunication networks," according to the company.
Not shy, 3S Photoncis – formerly Avanex France and, before that, Alcatel Optronics – says it plans to gain 15% of the terrestrial pump laser module market by the end of 2008. This would represent around 20.000 units, generating $7 million.
The company says its long-term investment policy in R&D and resulting advances in submarine pump laser modules substantially contributed to the development of its terrestrial pump laser modules. This new generation of terrestrial pumps is powered by in-house chip technology fully qualified for submarine applications, which the company says ensures a high level of performance and reliability. A new packaging technology based on a direct coupling approach has been implemented to adjust to terrestrial market requirements.
3S Photonics has also increased its production capacity by contracting new partnerships with Asian manufacturers. The company has created an assembly line fully dedicated to terrestrial pump laser modules.
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