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Features 2003 P5



Pivotal year for pump lasers
By JAY TITUS, PowerNetix Lightwave--After the industry shakeout in 2002, market conditions this year will matter more to device vendors than technology and manufacturing advances.

GPON: The next big thing in optical access networks
By OREN MARMUR, FlexLight Networks--GPON technology offers a cost-effective, flexible, scalable means of provisioning voice and data services reliably over the access network.

Mintera achieves 10,000 km error-free transmission of 40-Gbit/sec data without electrical regeneration
March 28, 2003--At OFC this week, Mintera Corp. announced that it has demonstrated error-free transmission of 40 data channels operating at 40-Gbits/sec over a record distance of 10,000 km of transmission fiber without electrical regeneration.

OFS and Transmode demonstrate 16-channel CWDM solution for metro networks
March 26, 2003--OFC 2003 saw the demonstration of a commercial 16-channel CWDM solution using fiber from OFS and CWDM equipment from Transmode.

Corning estimates fiber market down 50% in 2002; optical systems down 60%
March 26, 2003--Corning estimates that the fiber market was down by about 50% on 2001, and that optical system spending was down by 60%, largely due to a 74% drop in North America.

Alcatel Optronics to transfer Lannion staff to Solutions Plastiques
March 26, 2003--French opto component maker Alcatel Optronics is to transfer some of its 180 staff at its site in Lannion, Brittany, France to Solutions Plastiques, a plastic moulding company.

New directions in 10-Gbit/sec modules
By PETER BRADSHAW, BitBlitz Communications--Several factors have driven the creation of a variety of multi-source agreements. ICs have kept pace with the trend.

Standardization of connector manufacturing processes
By GUY SHECHTER and JOYCE KILMER, PhD, Sagitta, Inc.--The use of an automated platform can save cost and improve yields, overcoming the lack of manufacturing standards.

Uncooled DFB lasers meet 10-Gbit/sec transponder performance requirements
By SHING-SHWANG YAO, PH.D., and DANIEL CHEN, Electronic Device Group, Mitsubishi Electric & Electronics USA, Inc.--The requirements for today's high-speed fiber-optic interconnect include low cost, high performance, and flexibility in packaging designs. While each of these areas presents a formidable challenge to traditional semiconductor lasers, uncooled DFB technology's maturity level now meets all these challenges.

The intelligent optical network: The new foundation for competitive networks
By JIM ARCHULETA, CIENA Corp.--With the industry downturn, maintaining or restoring profitability is clearly the primary objective of each telecommunications service provider.

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